Mechanism of Building-Up Deposited Layer during Electro-Spark Deposition

Effect of Deposition Regime on Tribological Behavior of VK8Coating on 1.2344 Tool Steel Obtained by Electro Spark Method

In this study, the effect of deposition regime on the wear behavior of VK8 coating applied to 1.2344 tool steel by electro spark method (ESA) was investigated. After sample preparation, the coating with high and low regime was applied. To assess the wear behavior, the pin on disk test method according to ASTM G99-04, was used. For surveying surface morphology and cross section of the coating as...

Effects of Al Doping on the Properties of ZnO Thin Films Deposited by Atomic Layer Deposition

The tuning of structural, optical, and electrical properties of Al-doped ZnO films deposited by atomic layer deposition technique is reported in this work. With the increasing Al doping level, the evolution from (002) to (100) diffraction peaks indicates the change in growth mode of ZnO films. Spectroscopic ellipsometry has been applied to study the thickness, optical constants, and band gap of...

Surface Passivation of Silicon Using HfO2 Thin Films Deposited by Remote Plasma Atomic Layer Deposition System

Hafnium oxide (HfO2) thin films have attracted much attention owing to their usefulness in equivalent oxide thickness scaling in microelectronics, which arises from their high dielectric constant and thermodynamic stability with silicon. However, the surface passivation properties of such films, particularly on crystalline silicon (c-Si), have rarely been reported upon. In this study, the HfO2 ...

In Situ Reaction Mechanism Studies on Atomic Layer Deposition

Seed - layer deposition Patterning Insulator deposition and patterning Seed - layer deposition Seed layer Substrate

Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...